BROWN OXIDATION - BOND PROCESS

It consists of the chemical treatment to improve or favor the adhesion of copper and resin in the pressing process of the inner layers.

It is also used in treatment of the outer layers for improve the adhesion of the solder mask.

  • Automatic dosing system.
  • Individual automatic dosing of all chemicals.
  • Modules manufactured in PP-H and white PP.
  • Superflex conveyor system for thickness of 0,05mm.

Standard process:

  • Multibond
  • Bondfilm
  • MecEtchBond
  • Nanogy – Glibrite
  • Circubond
  • Cobra Bond
  • Alpha-Prep

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