It consists in cooling the PCB before the post HAL treatment. This is done because after the HAL process, the board comes out at high temperatures and it is necessary to reduce the temperature of the PCB before the post HAL process, to avoid sudden changes in the PCB temperature.

  • System manufacured in PP-H and White PP.
  • Conveyor system using stainless steel band.
  • High flow fans for reduce the temperature of the PCB.

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